Composite electronic component and resistor device

ABSTRACT

A composite electronic component includes a capacitor device and a resistor device stacked together in a height direction. The capacitor device includes a capacitor body and first and second external electrodes. The resistor device includes a base, a resistive element, first and second upper surface conductors, first and second lower surface conductors, a first connection conductor, and a second connection conductor. The upper surface of the base of the resistor device faces the lower surface of the capacitor body of the capacitor device, the first upper surface conductor is electrically connected to the first external electrode, and the second upper surface conductor is electrically connected to the second external electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication No. 2016-176992 filed on Sep. 9, 2016. The entire contentsof this application are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a composite electronic componentincluding a resistor device and a capacitor device, and also relates toa resistor device included in a composite electronic component andstructured to be used in the composite electronic component.

2. Description of the Related Art

A variety of composite electronic components have been proposed eachincluding a resistor element (R) and a capacitor element (C) forachieving a higher degree of integration of electronic elements disposedon a circuit board.

For example, Japanese Patent Laying-Open No. 2001-338838 discloses acomposite electronic component including a chip-type capacitor includinga capacitor body and a resistive element disposed on an external surfaceof the capacitor body, and the resistive element is connected to a pairof external electrodes disposed on the external surface of the capacitorbody so that the resistor element and the capacitor element areelectrically connected to each other.

Japanese Patent Laying-Open No. H06-283301 discloses a compositeelectronic component into which chip-type devices having a rectangularparallelepiped shape and identical in shape and dimensions areintegrated. The chip-type devices are of two or more kinds selected froma group of chip-type resistors, chip-type thermistors, chip-typecapacitors, and chip-type varistors, for example. In this compositeelectronic component, the chip-type devices are laid on each other inthe direction of the thickness of these devices, and a lead frame coversrespective terminal electrodes of the devices together. The devices arethus integrated into the composite electronic component.

The composite electronic component disclosed in Japanese PatentLaying-Open No. 2001-338838 includes a resistive element formed directlyon the surface of the capacitor body, which increases the difficulty inprocessing during manufacture. In addition, electrical characteristicsof the resistive element are restricted by the size of the capacitorbody as well as by the shape and the size, for example, of the pair ofexternal electrodes disposed on the capacitor body. Consequently, thedegree of freedom in designing the composite electronic component issignificantly reduced.

As for the composite electronic component disclosed in Japanese PatentLaying-Open No. H06-283301, it is required to fabricate the differentchip-type devices to be integrated, so that these chip-type devices arerectangular parallelepipeds that are identical in shape and dimensions.Due to this, electrical characteristics of each chip-type device aresignificantly restricted. Consequently, the degree of freedom indesigning the composite electronic component is reduced as well.

The composite electronic components disclosed in Japanese PatentLaying-Open Nos. 2001-338838 and H06-283301 are both limited to theconfiguration in which the resistor element (R) and the capacitorelement (C) are electrically connected in parallel, due to the inherentstructures of the composite electronic components. Consequently, thedegree of freedom in designing a circuit is significantly limited. Useof these composite electronic components is, therefore, limited to aspecific circuit.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide compositeelectronic components in which a resistor element and a capacitorelement each having desired electrical characteristics are able to beeasily combined, which improves the degree of freedom in designing thecomposite electronic component.

A composite electronic component according to a preferred embodiment ofthe present invention includes a resistor device and a capacitor devicemounted on the resistor device in a height direction. The resistordevice includes an electrically insulating base including an uppersurface and a lower surface opposite to each other in the heightdirection, a resistive element disposed on the base, a first uppersurface conductor and a second upper surface conductor disposed on theupper surface of the base and separated from each other in a lengthdirection perpendicular or substantially perpendicular to the heightdirection, a first lower surface conductor and a second lower surfaceconductor disposed on the lower surface of the base and separated fromeach other in the length direction, a first connection conductorconnecting the first upper surface conductor to the first lower surfaceconductor, and a second connection conductor connecting the second uppersurface conductor to the second lower surface conductor. The capacitordevice includes a capacitor body including a lower surface crossing theheight direction, and a first external electrode and a second externalelectrode disposed on an outer surface of the capacitor body andseparated from each other in the length direction.

In a composite electronic component according to a preferred embodimentof the present invention, the upper surface of the base faces the lowersurface of the capacitor body in the height direction, the first uppersurface conductor is electrically connected to the first externalelectrode, and the second upper surface conductor is electricallyconnected to the second external electrode. The first connectionconductor and the second connection conductor are each defined by only aconductor located on an outer peripheral surface of the base.

In a composite electronic device according to another preferredembodiment of the present invention, the resistive element is disposedon the upper surface of the base and located between the first uppersurface conductor and the second upper surface conductor in the lengthdirection. In this case, the resistor device preferably further includesa third upper surface conductor and a fourth upper surface conductordisposed on the upper surface of the base, located between the firstupper surface conductor and the second upper surface conductor in thelength direction, and separated from each other, a third lower surfaceconductor and a fourth lower surface conductor disposed on the lowersurface of the base, located between the first lower surface conductorand the second lower surface conductor in the length direction, andseparated from each other, a third connection conductor connecting thethird upper surface conductor to the third lower surface conductor, anda fourth connection conductor connecting the fourth upper surfaceconductor to the fourth lower surface conductor. The third upper surfaceconductor and the fourth upper surface conductor may be connected to theresistive element. The third connection conductor and the fourthconnection conductor are each defined by only a conductor located on theouter peripheral surface of the base.

In a composite electronic device according to another preferredembodiment of the present invention, the third upper surface conductorand the fourth upper surface conductor may be separated from each otherin a width direction perpendicular or substantially perpendicular to theheight direction and the length direction.

In a composite electronic device according to another preferredembodiment of the present invention, the resistive element is disposedon the upper surface of the base. In this case, the resistor device mayfurther include a third upper surface conductor disposed on the uppersurface of the base and located between the first upper surfaceconductor and the second upper surface conductor in the lengthdirection, a third lower surface conductor disposed on the lower surfaceof the base and located between the first lower surface conductor andthe second lower surface conductor in the length direction, and a thirdconnection conductor connecting the third upper surface conductor to thethird lower surface conductor, and the first upper surface conductor andthe third upper surface conductor may be connected to the resistiveelement.

In a composite electronic device according to another preferredembodiment of the present invention, the resistive element is disposedon the upper surface of the base. In this case, the first upper surfaceconductor and the second upper surface conductor may be connected to theresistive element.

In a composite electronic device according to another preferredembodiment of the present invention, the resistor device furtherincludes a protective film covering the resistive element.

In a composite electronic device according to another preferredembodiment of the present invention, a maximum height of the protectivefilm from the upper surface of the base may be larger than respectivemaximum heights of the first upper surface conductor and the secondupper surface conductor from the upper surface of the base.

In a composite electronic device according to another preferredembodiment of the present invention, the resistive element is disposedon the lower surface of the base and located between the first lowersurface conductor and the second lower surface conductor in the lengthdirection. In this case, the resistor device may further include a thirdlower surface conductor and a fourth lower surface conductor disposed onthe lower surface of the base, located between the first lower surfaceconductor and the second lower surface conductor in the lengthdirection, and separated from each other, and the third lower surfaceconductor and the fourth lower surface conductor may be connected to theresistive element.

In a composite electronic device according to another preferredembodiment of the present invention, preferably, the third lower surfaceconductor and the fourth lower surface conductor may be separated fromeach other in a width direction perpendicular or substantiallyperpendicular to the height direction and the length direction.

In a composite electronic device according to another preferredembodiment of the present invention, the resistor device furtherincludes a protective film covering the resistive element.

In a composite electronic device according to another preferredembodiment of the present invention, the resistive element is embeddedin the base and located between the first connection conductor and thesecond connection conductor in the length direction. In this case, theresistor device may further include a third upper surface conductor anda fourth upper surface conductor disposed on the upper surface of thebase, located between the first upper surface conductor and the secondupper surface conductor in the length direction, and separated from eachother, a third lower surface conductor and a fourth lower surfaceconductor disposed on the lower surface of the base, located between thefirst lower surface conductor and the second lower surface conductor inthe length direction, and separated from each other, a third connectionconductor connecting the third upper surface conductor to the thirdlower surface conductor, and a fourth connection conductor connectingthe fourth upper surface conductor to the fourth lower surfaceconductor, and the third and fourth connection conductors may beconnected to the resistive element. The third connection conductor andthe fourth connection conductor are each defined by only a conductorlocated on the outer peripheral surface of the base.

In a composite electronic device according to another preferredembodiment of the present invention, the capacitor body includes aplurality of internal electrode layers stacked together. One of a pairof internal electrode layers adjacent to each other among the pluralityof internal electrode layers is electrically connected to one of thefirst external electrode and the second external electrode and the otherof the pair of internal electrode layers is electrically connected tothe other of the first external electrode and the second externalelectrode. A stacking direction in which the plurality of internalelectrode layers are stacked together is perpendicular or substantiallyperpendicular to the height direction.

In a composite electronic device according to another preferredembodiment of the present invention, preferably, the capacitor deviceincludes surfaces crossing the stacking direction in which the pluralityof internal electrode layers are stacked, as seen in the lengthdirection, and the surfaces of the capacitor device are each curvedoutward in a convex shape.

In a composite electronic device according to another preferredembodiment of the present invention, the capacitor device includessurfaces extending along the stacking direction in which the pluralityof internal electrode layers are stacked, as seen in the lengthdirection, and the surfaces of the capacitor device are each curved sothat respective centers are recessed inward.

In a composite electronic device according to another preferredembodiment of the present invention, the first upper surface conductorand the first external electrode are connected to each other through afirst joint member. The second upper surface conductor and the secondexternal electrode are connected to each other through a second jointmember.

In a composite electronic device according to another preferredembodiment of the present invention, the first joint member and thesecond joint member are each made of a conductive joint material.

In a composite electronic device according to another preferredembodiment of the present invention, a main component of the conductivejoint material is Sn (tin).

In a composite electronic device according to another preferredembodiment of the present invention, the conductive joint materialcontains Sb (antimony) or Au (gold).

In a composite electronic device according to another preferredembodiment of the present invention, Ag (silver) and Cu (copper) areabsent in the conductive joint material.

In a composite electronic device according to another preferredembodiment of the present invention, the conductive joint material has amelting point of about 237° C. or more, for example.

In a composite electronic device according to another preferredembodiment of the present invention, a resin film extending continuouslyon the capacitor device and the resistor device covers at least aportion of a surface of each of the first joint member and the secondjoint member.

In a composite electronic device according to another preferredembodiment of the present invention, the resin film covers a wholesurface of each of the first joint member and the second joint member.

In a composite electronic device according to another preferredembodiment of the present invention, the first external electrode andthe second external electrode each include an Sn (tin) plating layer andan Sn—Ni (nickel) layer covered by the Sn plating layer and containingan intermetallic compound of Sn and Ni. The Sn—Ni layer is exposed fromat least a portion of each of the first external electrode and thesecond external electrode.

In a composite electronic device according to another preferredembodiment of the present invention, the Sn—Ni layer is exposed fromvertices and edges of each of the first external electrode and thesecond external electrode.

In a composite electronic device according to another preferredembodiment of the present invention, the first external electrode andthe second external electrode are each smaller in width than thecapacitor body.

In a composite electronic device according to another preferredembodiment of the present invention, the resistor device is larger inwidth than the capacitor device.

In a composite electronic device according to another preferredembodiment of the present invention, the resistor device is larger inlength than the capacitor device.

A resistor device according to a preferred embodiment of the presentinvention includes an electrically insulating base including an uppersurface and a lower surface opposite to each other in a heightdirection, a resistive element disposed on the base, a first uppersurface conductor and a second upper surface conductor disposed on theupper surface of the base and separated from each other in a lengthdirection perpendicular or substantially perpendicular to the heightdirection, a first lower surface conductor and a second lower surfaceconductor disposed on the lower surface of the base and separated fromeach other in the length direction, a first connection conductorconnecting the first upper surface conductor to the first lower surfaceconductor, a second connection conductor connecting the second uppersurface conductor to the second lower surface conductor, a third uppersurface conductor and a fourth upper surface conductor disposed on theupper surface of the base, located between the first upper surfaceconductor and the second upper surface conductor in the lengthdirection, and separated from each other, a third lower surfaceconductor and a fourth lower surface conductor disposed on the lowersurface of the base, located between the first lower surface conductorand the second lower surface conductor in the length direction, andseparated from each other, a third connection conductor connecting thethird upper surface conductor to the third lower surface conductor, anda fourth connection conductor connecting the fourth upper surfaceconductor to the fourth lower surface conductor. The resistive elementis disposed on the upper surface of the base and located between thefirst upper surface conductor and the second upper surface conductor inthe length direction. In the resistor device according to this preferredembodiment of the present invention, the third upper surface conductorand the fourth upper surface conductor are connected to the resistiveelement. The first connection conductor and the second connectionconductor are each defined by only a conductor located on an outerperipheral surface of the base. The third connection conductor and thefourth connection conductor are each defined by only a conductor locatedon the outer peripheral surface of the base.

In a resistor device according to another preferred embodiment of thepresent invention, the third upper surface conductor and the fourthupper surface conductor are separated from each other in a widthdirection perpendicular or substantially perpendicular to the heightdirection and the length direction.

Preferably, the resistor device according to a preferred embodiment ofthe present invention further includes a protective film covering theresistive element.

In a resistor device according to another preferred embodiment of thepresent invention, a maximum height of the protective film from theupper surface of the base may be larger than respective maximum heightsof the first upper surface conductor and the second upper surfaceconductor from the upper surface of the base.

A resistor device according to another preferred embodiment of thepresent invention includes an electrically insulating base including anupper surface and a lower surface opposite to each other in a heightdirection, a resistive element disposed on the base, a first uppersurface conductor and a second upper surface conductor disposed on theupper surface of the base and separated from each other in a lengthdirection perpendicular or substantially perpendicular to the heightdirection, a first lower surface conductor and a second lower surfaceconductor disposed on the lower surface of the base and separated fromeach other in the length direction, a first connection conductorconnecting the first upper surface conductor to the first lower surfaceconductor, a second connection conductor connecting the second uppersurface conductor to the second lower surface conductor; and a thirdlower surface conductor and a fourth lower surface conductor disposed onthe lower surface of the base, located between the first lower surfaceconductor and the second lower surface conductor in the lengthdirection, and separated from each other. The resistive element isdisposed on the lower surface of the base and located between the firstlower surface conductor and the second lower surface conductor in thelength direction. The third lower surface conductor and the fourth lowersurface conductor are connected to the resistive element. The firstconnection conductor and the second connection conductor are eachdefined by only a conductor located on an outer peripheral surface ofthe base.

In a resistor device according to another preferred embodiment of thepresent invention, the third lower surface conductor and the fourthlower surface conductor may be separated from each other in a widthdirection perpendicular to the height direction and the lengthdirection.

A resistor device according to another preferred embodiment of thepresent invention may further include a protective film covering theresistive element.

A resistor device according to another preferred embodiment of thepresent invention includes an electrically insulating base including anupper surface and a lower surface opposite to each other in a heightdirection, a resistive element disposed on the base, a first uppersurface conductor and a second upper surface conductor disposed on theupper surface of the base and separated from each other in a lengthdirection perpendicular or substantially perpendicular to the heightdirection, a first lower surface conductor and a second lower surfaceconductor disposed on the lower surface of the base and separated fromeach other in the length direction, a first connection conductorconnecting the first upper surface conductor to the first lower surfaceconductor, a second connection conductor connecting the second uppersurface conductor to the second lower surface conductor, a third uppersurface conductor and a fourth upper surface conductor disposed on theupper surface of the base, located between the first upper surfaceconductor and the second upper surface conductor in the lengthdirection, and separated from each other, a third lower surfaceconductor and a fourth lower surface conductor disposed on the lowersurface of the base, located between the first lower surface conductorand the second lower surface conductor in the length direction, andseparated from each other, a third connection conductor connecting thethird upper surface conductor to the third lower surface conductor, anda fourth connection conductor connecting the fourth upper surfaceconductor to the fourth lower surface conductor. The resistive elementis embedded in the base and located between the first connectionconductor and the second connection conductor in the length direction.In the resistor device according to this preferred embodiment of thepresent invention, the third connection conductor and the fourthconnection conductor are connected to the resistive element. The firstconnection conductor and the second connection conductor are eachdefined by only a conductor located on an outer peripheral surface ofthe base. The third connection conductor and the fourth connectionconductor are each defined by only a conductor located on the outerperipheral surface of the base.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a composite electroniccomponent according to a first preferred embodiment of the presentinvention.

FIG. 2A is a schematic cross-sectional view along a line IIA-IIA shownin FIG. 1.

FIG. 2B is a schematic cross-sectional view along a line IIB-IIB shownin FIG. 1.

FIG. 3A is a top view of a resistor device shown in FIG. 1.

FIG. 3B is a bottom view of the resistor device shown in FIG. 1.

FIG. 4 is a diagram showing an equivalent circuit of the compositeelectronic component shown in FIG. 1.

FIG. 5 is a schematic perspective view illustrating how the compositeelectronic component shown in FIG. 1 is mounted on a circuit board.

FIG. 6A is a lengthwise cross-sectional view of a mount structureincluding the composite electronic component shown in FIG. 1.

FIG. 6B is a widthwise cross-sectional view of the mount structureincluding the composite electronic component shown in FIG. 1.

FIG. 7A is a cross-sectional view in an enlarged form of a main portionof the composite electronic component shown in FIG. 1.

FIG. 7B is an enlarged cross-sectional view of the main component of thecomposite electronic component according to another exampleconfiguration based on the first preferred embodiment of the presentinvention.

FIG. 8A is a lengthwise cross-sectional view of a composite electroniccomponent according to a first modification of a preferred embodiment ofthe present invention.

FIG. 8B is a widthwise cross-sectional view of the composite electroniccomponent according to the first modification of a preferred embodimentof the present invention.

FIG. 9A is a lengthwise cross-sectional view of a composite electroniccomponent according to a second modification of a preferred embodimentof the present invention.

FIG. 9B is a widthwise cross-sectional view of the composite electroniccomponent according to the second modification of a preferred embodimentof the present invention.

FIG. 10 is a schematic perspective view of a composite electroniccomponent in a second preferred embodiment of the present invention.

FIG. 11A is a schematic cross-sectional view along a line XIA-XIA shownin FIG. 10.

FIG. 11B is a schematic cross-sectional view along a line XIB-XIB shownin FIG. 10.

FIG. 12A is a top view of a resistor device shown in FIG. 10.

FIG. 12B is a bottom view of the resistor device shown in FIG. 10.

FIG. 13 is a diagram showing an equivalent circuit of the compositeelectronic component shown in FIG. 10.

FIG. 14 is a side view of a composite electronic component in a thirdpreferred embodiment of the present invention.

FIG. 15 is a diagram of the composite electronic component in FIG. 14 asseen in the direction of an arrow XV.

FIG. 16 is a diagram of the composite electronic component in FIG. 14 asseen in the direction of an arrow XVI.

FIG. 17 is a cross-sectional view of the composite electronic componentin FIG. 15 as seen in the direction of an arrow XVII-XVII.

FIG. 18 is a cross-sectional view of the composite electronic componentin FIG. 15 as seen in the direction of an arrow XVIII-XVIII.

FIG. 19 is a cross-sectional view of the composite electronic componentin FIG. 14 as seen in the direction of an arrow XIX-XIX.

FIG. 20 is a cross-sectional view showing a state in which a compositeelectronic component in which the direction in which internal electrodelayers are stacked is parallel or substantially parallel to the heightdirection is sucked with a nozzle of a mounter.

FIG. 21 is a cross-sectional view showing a state in which a compositeelectronic component in the present preferred embodiment in which thedirection in which internal electrode layers are stacked isperpendicular or substantially perpendicular to the height direction issucked with a nozzle of a mounter.

FIG. 22 is a side view of a composite electronic component in a fourthpreferred embodiment of the present invention.

FIG. 23 is a diagram of the composite electronic component in FIG. 22 asseen in the direction of an arrow XXIII.

FIG. 24 is a diagram of the composite electronic component in FIG. 22 asseen in the direction of an arrow XXIV.

FIG. 25 is a side view of a composite electronic component in a fifthpreferred embodiment of the present invention.

FIG. 26 is a diagram of the composite electronic component in FIG. 25 asseen in the direction of an arrow XXVI.

FIG. 27 is a diagram of the composite electronic component in FIG. 25 asseen in the direction of an arrow XXVII.

FIG. 28 is a perspective view showing a composite electronic componentin which a resistor device is larger in width than a capacitor deviceand larger in length than the capacitor device.

FIG. 29 is a perspective view showing a composite electronic componentin which a resistor device is larger in width than a capacitor deviceand smaller in length than the capacitor device.

FIG. 30 is a side view showing a state where a composite electroniccomponent in which a resistor device is equal in width to a capacitordevice is mounted in an inclined posture on a circuit board.

FIG. 31 is a side view showing a state where a composite electroniccomponent in which a resistor device is larger in width than a capacitordevice is mounted in an inclined posture on a circuit board.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following, preferred embodiments of the present invention will bedescribed in detail with reference to the drawings. Regarding thefollowing preferred embodiments, the same or common structure andelements in the drawings are denoted by the same reference characters,and a description thereof will not be repeated.

First Preferred Embodiment

FIG. 1 is a schematic perspective view of a composite electroniccomponent according to a first preferred embodiment of the presentinvention. FIG. 2A is a schematic cross-sectional view along a lineIIA-IIA shown in FIG. 1. FIG. 2B is a schematic cross-sectional viewalong a line IIB-IIB shown in FIG. 1. FIG. 3A is a top view of aresistor device shown in FIG. 1. FIG. 3B is a bottom view of theresistor device shown in FIG. 1. FIG. 4 is a diagram showing anequivalent circuit of the composite electronic component shown inFIG. 1. Referring first to FIGS. 1 to 4, a composite electroniccomponent 1A in the present preferred embodiment is described.

As shown in FIG. 1, the composite electronic component 1A in the presentpreferred embodiment includes a capacitor device and a resistor device20A, and has a rectangular or substantially rectangular parallelepipedshape as a whole.

Capacitor device 10 has a rectangular or substantially rectangularparallelepiped shape, and has a dimension in a length direction Ldefined later larger than a dimension in a width direction W definedlater. The rectangular or substantially rectangular parallelepiped shapereferred to herein includes a rectangular parallelepiped shape ofcapacitor device 10 including vertices and edges that are rounded and/orhaving an external surface that is stepped or roughened, for example.

Resistor device 20A has an elongate flat plate shape, and has adimension in length direction L larger than a dimension in widthdirection W. The flat plate shape referred to herein includes a flatplate shape of resistor device 20A having vertices and edges that arerounded, and/or having an external surface stepped or roughened, forexample.

Capacitor device 10 is disposed on resistor device 20A, and joined toresistor device 20A through a first joint member 31 and a second jointmember 32 of a solder joint material or a conductive joint material,such as conductive adhesive, for example. The method of joiningcapacitor device 10 to resistor device 20A is not limited to the methodof joining them with a conductive joint material, and another joiningmethod may be used.

As to terms representing directions used to define composite electroniccomponent 1A, the direction in which capacitor device 10 and resistordevice 20A are arranged is referred to as height direction H, thedirection in which a first external electrode 14A and a second externalelectrode 14B of capacitor device 10 described later are arranged isreferred to as length direction L, and the direction perpendicular orsubstantially perpendicular to both height direction H and lengthdirection L is referred to as width direction W. These terms are used inthe following description.

As shown in FIGS. 1, 2A and 2B, capacitor device 10 is preferably amultilayer ceramic capacitor, for example, and includes a capacitor body11, and first and second external electrodes 14A and 14B. Capacitor body11 has a rectangular or substantially rectangular parallelepiped shape,and first and second external electrodes 14A and 14B structured in afilm shaped on the external surface of capacitor body 11 are separatedfrom each other.

Capacitor body 11 includes a plurality of dielectric layers 12 and aplurality of internal electrode layers 13 that are alternately stacked.In the present preferred embodiment, the direction in which a pluralityof dielectric layers 12 and a plurality of internal electrode layers 13are stacked is preferably identical or substantially identical to heightdirection H. The direction in which these layers are stacked, however,may be identical or substantially identical to width direction W.

Dielectric layer 12 is preferably made of a ceramic material containing,as a main component, barium titanate (BaTiO₃), calcium titanate(CaTiO₃), strontium titanate (SrTiO₃), calcium zirconium (CaZrO₃), orother suitable material, for example. Dielectric layers 12 maypreferably further contain, as an accessory component, Mn, Mg, Si, Co,Ni, rare earth, or other suitable component, for example. In contrast,internal electrode layer 13 is preferably made of a metal material suchas Ni, Cu, Ag, Pd, Ag—Pd alloy, Au, or other suitable metal material,for example.

First and second external electrodes 14A and 14B are each preferablymade of a conductive film that is a multilayer film including a sinteredmetal layer and a plating layer, for example. The sintered metal layeris formed by baking a paste of Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, or othersuitable material, for example. The plating layer is preferably made ofan Ni plating layer and an Sn plating layer covering the Ni platinglayer, for example. Alternatively, the plating layer may be a Cu platinglayer or Au plating layer. First and second external electrodes 14A and14B may preferably each be defined by a plating layer only, or by ahardened conductive resin paste containing a metal component and a resincomponent, for example.

Capacitor body 11 includes a pair of end surfaces opposite to each otherin length direction L, a pair of side surfaces opposite to each other inwidth direction W, and a pair of main surfaces opposite to each other inheight direction H. Among these surfaces, a lower surface 11 a, which isone of the pair of main surfaces opposite to each other in heightdirection H, faces resistor device 20A.

First external electrode 14A is disposed to abut one end surface ofcapacitor body 11 and respective portions of the pair of side surfacesand the pair of main surfaces of capacitor body 11. Second externalelectrode 14B is disposed to abut the other end surface of capacitorbody 11 and respective portions of the pair of side surfaces and thepair of main surfaces of capacitor body 11. Accordingly, lower surface11 a of capacitor body 11 is partially covered by first and secondexternal electrodes 14A and 14B that are separated from each other inlength direction L. Between first and second external electrodes 14A and14B, lower surface 11 a of capacitor body 11 is exposed.

As shown in FIGS. 2A and 2B, one of a pair of internal electrode layers13 that are adjacent to each other in height direction H with dielectriclayer 12 interposed therebetween is electrically connected, in capacitordevice 10, to one of first and second external electrodes 14A and 14B,and the other internal electrode layer 13 is electrically connected, incapacitor device 10, to the other of first and second externalelectrodes 14A and 14B. Accordingly, between first and second externalelectrodes 14A and 14B, a plurality of capacitor elements (C) areelectrically connected in parallel.

Capacitor device 10 may be manufactured, for example, by the followingnon-limiting example of a process. A raw sheet is prepared by printingan electrically conductive paste that is to form an internal electrodelayer 13, on a surface of a ceramic sheet (green sheet) that is to forma dielectric layer 12. A plurality of raw sheets thus prepared arestacked, joined together by pressure, and fired to produce capacitorbody 11. After this, first and second external electrodes 14A and 14Bare formed on the external surface of capacitor body 11 to form thecapacitor device. A collective body into which a plurality of capacitorbodies 11 are integrated may be fabricated in advance, and thecollective body may be separated into a plurality of capacitor bodies11, and thereafter first and second external electrodes 14A and 14B maybe formed on each capacitor body 11.

As shown in FIGS. 1 to 3B, resistor device 20A includes an electricallyinsulating base 21, a resistive element 22, a protective film 23, first,second, third, and fourth upper surface conductors 24A, 24B, 24C, and24D, first, second, third, and fourth lower surface conductors 25A, 25B,25C, and 25D, and first, second, third, and fourth side surfaceconductors 27A, 27B, 27C, and 27D defining and functioning as first,second, third, and fourth connection conductors, respectively.Specifically, the first connection conductor and the second connectionconductor are preferably each defined by only a conductor located on theouter peripheral surface of base 21. The third connection conductor andthe fourth connection conductor are preferably each defined by only aconductor located on the outer peripheral surface of base 21.

Base 21 has a flat plate shape, and is made of a resin material, such asepoxy resin, a ceramic material, such as alumina, or is made of a resinmaterial or a ceramic material to which filler, woven fabric, or thelike of an inorganic material or an organic material is added, forexample. Preferably, an alumina substrate or a ceramic substrateincluding low temperature co-fired ceramic (LTCC) substrate is used asbase 21.

Base 21 includes a pair of longitudinally-opposing side surfacesopposite to each other in length direction L, a pair oflaterally-opposing side surfaces opposite to each other in widthdirection W, and a pair of main surfaces opposite to each other inheight direction H. An upper surface 21 a that is one of the pair ofmain surfaces faces capacitor device 10, and a lower surface 21 b thatis the other of the pair of main surfaces is a mount surface that facesa circuit board on which composite electronic component 1A is to bemounted.

As shown in FIGS. 2A to 3B, resistive element 22 is disposed at apredetermined position on upper surface 21 a of base 21, and has arectangular or substantially rectangular film shape as seen in thedirection perpendicular or substantially perpendicular to upper surface21 a of base 21, for example. As resistive element 22, a metal film, ametal oxide film, a metal glaze film that is a mixture of a metal oxidefilm and glass, or other suitable material may be used, for example.

Protective film 23 covers at least a portion of resistive element 22 onupper surface 21 a of base 21, and is made of an electrically insulatingfilm of a glass material, a resin material, or other suitable material,for example. Preferably, protective film 23 covers the whole ofresistive element 22 so that resistive element 22 is not exposedoutward.

First and second upper surface conductors 24A and 24B are disposed onupper surface 21 a of base 21, and each defined by a rectangular orsubstantially rectangular conductive film. First and second uppersurface conductors 24A and 24B are separated from each other in lengthdirection L and located at the opposite ends in length direction L ofupper surface 21 a of base 21.

Third and fourth upper surface conductors 24C and 24D are disposed onupper surface 21 a of base 21, and each defined by a rectangular orsubstantially rectangular conductive film. Third and fourth uppersurface conductors 24C and 24D are located between first upper surfaceconductor 24A and second upper surface conductor 24B in length directionL. Third and fourth upper surface conductors 24C and 24C are separatedfrom each other in width direction W and located at the opposite ends inwidth direction W of upper surface 21 a of base 21.

In order to prevent first to fourth upper surface conductors 24A to 24Bfrom peeling off of base 21, it is preferable to embed at least aportion of each of first to fourth upper surface conductors 24A to 24Din base 21. In particular, in order to prevent first and second uppersurface conductors 24A and 24B from peeling off from base 21 due to abonding force applied when capacitor device 10 is joined to resistordevice 20A, at least a portion of each of first and second upper surfaceconductors 24A and 24B is preferably embedded in base 21.

First and second lower surface conductors 25A and 25B are disposed onlower surface 21 b of base 21, and each defined by a rectangular orsubstantially rectangular conductive film. First and second lowersurface conductors 25A and 25B are separated from each other in lengthdirection L and located at opposite ends, in length direction L of lowersurface 21 b of base 21.

Third and fourth lower surface conductors 25C and 25D are disposed onlower surface 21 b of base 21, and each defined by a rectangular orsubstantially rectangular conductive film. Third and fourth lowersurface conductors 25C and 25D are located between first lower surfaceconductor 25A and second lower surface conductor 25B in length directionL. Third and fourth lower surface conductors 25C and 25C are separatedfrom each other in width direction W and located at the opposite ends inwidth direction W of lower surface 21 b of base 21.

First side surface conductor 27A covers one of the pair oflongitudinally-opposing side surfaces of base 21 that are opposite toeach other in length direction L, and connects first upper surfaceconductor 24A to first lower surface conductor 25A. Second side surfaceconductor 27B covers the other of the pair of longitudinally-opposingside surfaces of base 21 that are opposite to each other in lengthdirection L, and connects second upper surface conductor 24B to secondlower surface conductor 25B.

Third side surface conductor 27C covers one of the pair oflaterally-opposing side surfaces of base 21 that are opposite to eachother in width direction W, and connects third upper surface conductor24C to third lower surface conductor 25C. Fourth side surface conductor27D covers the other of the pair of laterally-opposing side surfaces ofbase 21 that are opposite to each other in width direction W, andconnects fourth upper surface conductor 24D to fourth lower surfaceconductor 25D.

First to fourth upper surface conductors 24A to 24D, first to fourthlower surface conductors 25A to 25D, and first to fourth side surfaceconductors 27A to 27D may each be made of any of various conductivematerials. Preferably, they may each be made of a metal material such asCu, Ni, and Sn, and formed by plating, baking of a conductive paste,sputtering, or other suitable method, for example.

Resistive element 22 is located between first upper surface conductor24A and second upper surface conductor 24B in length direction L, andone end in width direction W of resistive element 22 covers a portion ofthird upper surface conductor 24C and the other end in width direction Wthereof covers a portion of fourth upper surface conductor 24D.Accordingly, third and fourth upper surface conductors 24C and 24D areconnected to resistive element 22.

In order to prevent physical interference between resistor device 20Aand capacitor device 10, the dimension in length direction L ofresistive element 22 is preferably smaller than the distance betweenfirst external electrode 14A and second external electrode 14B ofcapacitor device 10.

In order to prevent contact with other conductive members, protectivefilm 23 preferably covers not only resistive element 22 but also thirdand fourth upper surface conductors 24C and 24D. Third and fourth uppersurface conductors 24C and 24D, however, may not necessarily be coveredby protective film 23. Third and fourth upper surface conductors 24C and24D may be covered only partially, or may not be covered at all.

Resistor device 20A may be manufactured, for example, through thefollowing non-limiting example of a process.

First, electrically insulating base 21 is prepared. Next, a conductivepaste is printed and baked on upper surface 21 a and lower surface 21 bof base 21, or a metal material is deposited by sputtering on uppersurface 21 a and lower surface 21 b of base 21, for example, to formfirst to fourth upper surface conductors 24A to 24D and first to fourthlower surface conductors 25A to 25D.

After this, a conductive paste is applied and hardened on the pair oflongitudinally-opposing side surfaces and the pair of laterally-opposingside surfaces of base 21, or a plating layer is formed on the pair oflongitudinally-opposing side surfaces and the pair of laterally-opposingside surfaces of base 21, for example, to form first to fourth sidesurface conductors 27A to 27D.

Then, a material that is to form resistive element 22 is formed byprinting or other suitable method on upper surface 21 a of base 21 toconnect resistive element 22 to third and fourth upper surfaceconductors 24C and 24D.

After this, a glass material, a resin material, or other suitablematerial is applied by printing or other suitable method onto uppersurface 21 a of base 21 to cover resistive element 22, and formprotective film 23.

In this way, resistor device 20A is manufactured. The above-describedprocedure is given merely by way of example. The order of the steps inthe above-described process may be partially changed, or any suitablemethod other than the above-described methods may be used to form eachelement. Alternatively, a collective body into which a plurality ofresistor devices 20A are integrated may be fabricated in advance and thecollective body may be divided into separate resistor devices 20A sothat a plurality of resistor devices 20A are manufactured together.

As shown in FIGS. 1, 2A, and 2B, in composite electronic component 1A inthe present preferred embodiment, capacitor device 10 and resistordevice 20A are joined together through first and second joint members 31and 32.

More specifically, capacitor device 10 is mounted on upper surface 21 aof resistor device 20A in height direction H. Lower surface 11 a ofcapacitor body 11 faces upper surface 21 a of base 21 in heightdirection H, and first and second external electrodes 14A and 14B ofcapacitor device 10 are joined to respective corresponding first andsecond upper surface conductors 24A and 24B of resistor device 20Athrough first and second joint members 31 and 32, respectively.

Accordingly, first and second external electrodes 14A and 14B areelectrically connected to first and second upper surface conductors 24Aand 24B, respectively. Then, first and second upper surface conductors24A and 24B and first and second side surface conductors 27A and 27Bconnected respectively to first and second upper surface conductors 24Aand 24B define and function as a relay conductor for capacitor device 10to electrically connect first and second external electrodes 14A and 14Bto first and second lower surface conductors 25A and 25B, respectively.

Thus, first and second lower surface conductors 25A and 25B and firstand second side surface conductors 27A and 27B of resistor device 20Aare define and function as terminal conductors that are connectingterminals connecting capacitor device 10 to a circuit board.

In contrast, resistive element 22 of resistor device 20A is electricallyconnected to third and fourth upper surface conductors 24C and 24D ofresistor device 20A as described above. Then, third and fourth sidesurface conductors 27C and 27D connected respectively to third andfourth upper surface conductors 24C and 24D define and function as arelay conductor for resistive element 22 to electrically connect thirdand fourth upper surface conductors 24C and 24D to third and fourthlower surface conductors 25C and 25D, respectively.

Thus, third and fourth lower surface conductors 25C and 25D and as thirdand fourth side surface conductors 27C and 27D of resistor device 20Adefine and function as terminal conductors that are connecting terminalsconnecting resistor device 20A to a circuit board.

Accordingly, composite electronic component 1A in the present preferredembodiment includes four terminal conductors that are connectingterminals to a circuit board, and has an equivalent circuit as shown inFIG. 4.

Composite electronic component 1A configured in the above-describedmanner eliminates the need to provide a resistive element directly onthe surface of the capacitor body, which facilitates processing duringmanufacture. In addition, electrical characteristics of the resistiveelement are not restricted by the size of the capacitor body and/or theshape and the size, for example, of the pair of external electrodesdisposed on the capacitor body. Consequently, the degree of freedom indesigning the composite electronic component is significantly improved.

Composite electronic component 1A configured in the above-describedmanner also eliminates the need to fabricate capacitor device 10 andresistor device 20A to be integrated so that they are rectangular orsubstantially rectangular parallelepipeds that are identical orsubstantially identical in shape and size. In addition, electricalcharacteristics of capacitor device 10 and resistor device 20A are notrestricted in this sense. The degree of freedom in designing thecomposite electronic component is therefore significantly improved inthis respect as well.

Further, regarding composite electronic component 1A configured in theabove-described manner, the resistor element (R) and the capacitorelement (C) are not electrically connected in parallel in compositeelectronic component 1A. In terms of circuit design, the degree offreedom in designing a circuit is also significantly improved.Specifically, the resistor element (R) and the capacitor element (C) areelectrically connected to each other on a circuit board on whichcomposite electronic component 1A is mounted, and therefore, they can beconnected either in series or in parallel. In some cases, the resistorelement and the capacitor element may be connected to respectiveseparate circuits. Accordingly, a composite electronic component that isapplicable to a variety of circuits is provided.

In addition, composite electronic component 1A configured in theabove-described manner also enables a reduction in the surface area onwhich the component is mounted, due to the integration of capacitordevice 10 and resistor device 20A into the composite electroniccomponent.

In order to reduce the surface area, preferably, the dimension ofcapacitor device 10 in length direction L is larger than the dimensionof resistor device 20A in length direction L, and the dimension ofcapacitor device 10 in width direction W is larger than the dimension ofresistor device 20A in width direction W. In order to increase thecapacitance of capacitor device 10, preferably, the dimension ofcapacitor device 10 in height direction H is larger than the dimensionof resistor device 20A in height direction H.

As described above, regarding composite electronic component 1A andresistor device 20A included in composite electronic component 1A in thepresent preferred embodiment, the resistor element (R) and the capacitorelement (C) each having desired electrical characteristics are easilycombined, which enables a higher degree of freedom in designing thecomposite electronic component and a higher degree of freedom indesigning a circuit on a circuit board on which the composite electroniccomponent is mounted.

As capacitor device 10 to be integrated into the composite electroniccomponent, multiple types of capacitor devices 10 that are different inelectrical characteristics may be prepared in advance. In addition, asresistor device 20A to be integrated into the composite electroniccomponent, multiple types of resistor devices 20A that are different inelectrical characteristics may be prepared in advance. Then, a capacitordevice and a resistor device may be selected and combined appropriately.In this way, a composite electronic component including both a resistorelement (R) and a capacitor element (C) having desired electricalcharacteristics is easily manufactured. At this time, the multiple typesof capacitor devices may not necessarily be identical to each other inshape and dimensions, and the multiple types of resistor devices may notnecessarily be identical to each other in shape and dimensions. As longas a selected type of capacitor device and a selected type of resistordevice are able to be stacked and combined into a composite electroniccomponent, the multiple types of capacitor devices may be different andthe multiple types of resistor devices may be different in terms ofshape and dimensions.

In the present preferred embodiment, third upper surface conductor 24Cand fourth upper surface conductor 24D that are connected to resistiveelement 22 are separated from each other in width direction Wperpendicular or substantially perpendicular to length direction L inwhich first upper surface conductor 24A and second upper surfaceconductor 24B functioning as a relay conductor for capacitor device 10are arranged. This configuration enables an increase of distances bywhich first to fourth upper surface conductors 24A and 24D are separatedfrom each other as well as increase of the area where resistive element22 may be disposed on upper surface 21 a of base 21. Both electricalinsulation between first to fourth upper surface conductors 24A to 24Dand a high degree of freedom in adjusting electrical characteristics ofresistive element 22 are therefore ensured.

FIG. 5 is a schematic perspective view illustrating how the compositeelectronic component shown in FIG. 1 is mounted on a circuit board. FIG.6A is a lengthwise cross-sectional view of a mount structure includingthe composite electronic component shown in FIG. 1. FIG. 6B is awidthwise cross-sectional view of the mount structure including thecomposite electronic component shown in FIG. 1. Referring to FIGS. 5,6A, and 6B, a mount structure to mount composite electronic component 1Aon a circuit board 100 in the present preferred embodiment is described.

As shown in FIG. 5, composite electronic component 1A is mounted oncircuit board 100 by disposing composite electronic component 1A so thatlower surface 21 b of base 21 of resistor device 20A faces a mainsurface 100 a of circuit board 100, and using a solder joint material ora conductive joint material, such as conductive adhesive, for example.

As shown in FIGS. 5, 6A, and 6B, circuit board 100 is an electricallyinsulating substrate including a conductive pattern provided on mainsurface 100 a. As a material for circuit board 100, a resin material,such as epoxy resin, a ceramic material such as alumina, or a resinmaterial or a ceramic material to which filler, woven fabric, or thelike of an inorganic material or an organic material is added, forexample, may be used. Generally, a glass epoxy substrate in which glasswoven fabric is added to a base material of epoxy resin is preferablyused as circuit board 100.

On main surface 100 a of circuit board 100, first to fourth lands 101Ato 101D are disposed for composite electronic component 1A. First tofourth lands 101A to 101D each correspond to a portion of the conductivepattern and are separated from each other.

The first to fourth lands 101A to 101D have respective sizescorresponding to respective sizes of first to fourth lower surfaceconductors 25A to 25D respectively of composite electronic component 1A,and include respective portions facing their associated first to fourthlower surface conductors 25A to 25D in the direction perpendicular orsubstantially perpendicular to main surface 100 a of circuit board 100.As the material for first to fourth lands 101A to 101D, any of variousconductive materials may be used, and preferably a metal material, suchas Cu is used.

The first to fourth lower surface conductors 25A to 25D and first tofourth side surface conductors 27A to 27D of composite electroniccomponent 1A are joined to the first to fourth lands 101A to 101Ddisposed on circuit board 100 by first, second, third, and fourth jointmount members 111, 112, 113, and 114 each made of a conductive jointmaterial. First to fourth side surface conductors 27A to 27D ofcomposite electronic component 1A enable first to fourth joint mountmembers 111 to 114 to include a fillet of an appropriate size, whichincreases the stability of mounted composite electronic component 1A.

Specific ones of first to fourth lands 101A to 101D may be electricallyconnected to each other to enable capacitor device and resistor device20A included in composite electronic component 1A to be connected eitherin series or in parallel on circuit board 100.

FIG. 7A is an enlarged cross-sectional view of a main portion of thecomposite electronic component in the present preferred embodiment. FIG.7B is an enlarged cross-sectional view of the main component of thecomposite electronic component according to another exampleconfiguration based on the present preferred embodiment.

As shown in FIG. 7A, in composite electronic component 1A in the presentpreferred embodiment, first and second joint members 31 and 32 arelocated between first and second upper surface conductors 24A and 24B onupper surface 21 a of base 21 of resistor device 20A and first andsecond external electrodes 14A and 14B located on lower surface 11 a ofcapacitor body 11 of capacitor device 10, respectively.

The distance in height direction H between upper surface 21 a of base 21and lower surface 11 a of capacitor body 11 is therefore the sum of thethickness in height direction H of each of first and second uppersurface conductors 24A and 24B, the thickness in height direction H ofthe portion of each of first and second external electrodes 14A and 14Bfacing first and second upper surface conductors 24A and 24B, and thethickness in height direction H of each of first and second jointmembers 31 and 32.

Resistive element 22 and protective film 23 disposed on upper surface 21a of base 21 face the exposed portion of lower surface 11 a of capacitorbody 11.

Accordingly, in composite electronic component 1A according to thepresent preferred embodiment, even when a maximum height H1 of first andsecond upper surface conductors 24A and 24B from upper surface 21 a ofbase 21 and a maximum height H2 of protective film 23 from upper surface21 a satisfy the condition H1<H2, protective film 23 and resistiveelement 22 do not physically interfere with capacitor device 10 as longas maximum height H2 is smaller than the distance in height direction Hbetween upper surface 21 a of base 21 and lower surface 11 a ofcapacitor body 11. Thus, increase of the dimension in height direction Hof composite electronic component 1A is avoided. Preferably, maximumheight H2 is smaller than the sum of maximum height H1 and the thicknessof the portion of first and second external electrodes 14A and 14Blocated on lower surface 11 a of capacitor device 10.

As shown in FIG. 7B, in a composite electronic component 1A′ accordingto another example configuration based on the present preferredembodiment, resistive element 22 is not covered by the protective film,and instead, is exposed on upper surface 21 a of base 21.

First Modification

FIG. 8A is a lengthwise cross-sectional view of a composite electroniccomponent according to a first modification of a preferred embodiment ofthe present invention. FIG. 8B is a widthwise cross-sectional view ofthe composite electronic component according to the first modification.Referring to FIGS. 8A and 8B, a composite electronic component 1A1according to the first modification of the present preferred embodimentis described below.

As shown in FIGS. 8A and 8B, composite electronic component 1A1 in thefirst modification differs from composite electronic component 1A inthat the first modification includes a differently structured resistordevice 20A2. Resistor device 20A2 differs from resistor device 20Aprimarily in the position of resistive element 22 disposed on base 21.Specifically, resistive element 22 is disposed on the lower surface ofbase 21 and located between first lower surface conductor 25A and secondlower surface conductor 25B in length direction L.

One end in width direction W of resistive element 22 covers a portion ofthird lower surface conductor 25C and the other end in width direction Wthereof covers a portion of fourth lower surface conductor 25D.Accordingly, third and fourth lower surface conductors 25C and 25D areconnected to resistive element 22.

Although resistor device 20A2 in the first modification does not includethird and fourth upper surface conductors 24C and 24D included inresistor device 20A, resistor device 20A2 may include these third andfourth upper surface conductors 24C and 24D without suffering from anyparticular disadvantages.

The above configuration of the first modification also produces similareffects to those described above in connection with the presentpreferred embodiment, and enables a resistor element (R) and a capacitorelement (C) having desired electrical characteristics to be easilycombined at low cost. Accordingly, a higher degree of freedom indesigning the composite electronic component and a higher degree offreedom in designing a circuit on a circuit board on which the compositeelectronic component is mounted are achieved.

Second Modification

FIG. 9A is a lengthwise cross-sectional view of a composite electroniccomponent according to a second modification of a preferred embodimentof the present invention. FIG. 9B is a widthwise cross-sectional view ofthe composite electronic component according to the second modification.Referring to FIGS. 9A and 9B, a composite electronic component 1A2according to the second modification based on the present preferredembodiment is described below.

As shown in FIGS. 9A and 9B, composite electronic component 1A2 in thesecond modification differs from composite electronic component 1A inthat the second modification includes a differently structured resistordevice 20A3. Resistor device 20A3 differs from resistor device 20Aprimarily in the position of resistive element 22 of base 21.Specifically, resistive element 22 is embedded in base 21 and locatedbetween first side surface conductor 27A and second side surfaceconductor 27B in length direction L.

One end in width direction W of resistive element 22 is connected tothird side surface conductor 27C and the other end in width direction Wthereof is connected to fourth side surface conductor 27D.

As shown in FIGS. 9A and 9B, resistor device 20A3 in the secondmodification may not include third and fourth upper surface conductors24C and 24D included in resistor device 20A.

The above configuration of the second modification also produces similareffects to those described above in connection with the presentpreferred embodiment, and enables a resistor element (R) and a capacitorelement (C) having desired electrical characteristics to be easilycombined at low cost. Accordingly, a higher degree of freedom indesigning the composite electronic component and a higher degree offreedom in designing a circuit on a circuit board on which the compositeelectronic component is mounted are achieved.

Second Preferred Embodiment

FIG. 10 is a schematic perspective view of a composite electroniccomponent in a second preferred embodiment of the present invention.FIG. 11A is a schematic cross-sectional view along a line XIA-XIA shownin FIG. 10. FIG. 11B is a schematic cross-sectional view along a lineXIB-XIB shown in FIG. 10. FIG. 12A is a top view of a resistor deviceshown in FIG. 10. FIG. 12B is a bottom view of the resistor device shownin FIG. 10. FIG. 13 is a diagram showing an equivalent circuit of thecomposite electronic component shown in FIG. 10. Referring to FIGS. 10to 13, a composite electronic component 1C in the present preferredembodiment is described below.

As shown in FIGS. 10 to 13, composite electronic component 1C in thepresent preferred embodiment differs from composite electronic component1A in that composite electronic component 1C includes a differentlystructured resistor device 20C. Resistor device 20C differs fromresistor device 20A primarily in that resistor device 20C does notinclude third and fourth upper surface conductors 24C and 24C, third andfourth lower surface conductors 25C and 25D, and third and fourth sidesurface conductors 27C and 27D. In addition, in the present preferredembodiment, the first connection conductor and the second connectionconductor are each defined by only a conductor located on the outerperipheral surface of base 21.

Specifically, as shown in FIGS. 11A to 12B, resistor device 20C does notinclude another conductor on the portion between first and second uppersurface conductors 24A and 24B in length direction L of upper surface 21a of base 21. Resistor device 20C also does not include anotherconductor on the portion between first and second lower surfaceconductors 25A and 25B in length direction L of lower surface 21 b ofbase 21.

One end in length direction L of resistive element 22 covers a portionof first upper surface conductor 24A and the other end in lengthdirection L thereof covers a portion of second upper surface conductor24B. Accordingly, first and second upper surface conductors 24A and 24Bare connected to resistive element 22.

In this case, resistive element 22 of resistor device 20C iselectrically connected to first and second upper surface conductors 24Aand 24B of resistor device 20C. Therefore, first and second side surfaceconductors 27A and 27B connected respectively to first and second uppersurface conductors 24A and 24B define and function as a relay conductorfor resistive element to electrically connect first and second uppersurface conductors 24A and 24B to first and second lower surfaceconductors 25A and 25B, respectively.

Thus, first and second lower surface conductors 25A and 25B and firstand second side surface conductors 27A and 27B of resistor device 20Care structured to function as terminal conductors that are connectingterminals connecting resistor device 20C to a circuit board.

In this case, first and second upper surface conductors 24A and 24B andfirst and second side surface conductors 27A and 27B are also structuredto function as a relay conductor for capacitor device 10. In addition,first and second lower surface conductors 25A and 25B and first andsecond side surface conductors 27A and 27B are also structured tofunction as terminal conductors that are connecting terminals connectingcapacitor device 10 to a circuit board.

Accordingly, composite electronic component 1C in the present preferredembodiment includes two terminal conductors that are connectingterminals to a circuit board, and has an equivalent circuit as shown inFIG. 13.

The configuration of the present preferred embodiment also producessimilar effects to those described above in connection with the firstpreferred embodiment, and enables a resistor element (R) and a capacitorelement (C) having desired electrical characteristics to be easilycombined. A higher degree of freedom in designing the compositeelectronic component is thus achieved.

Third Preferred Embodiment

FIG. 14 is a side view of a composite electronic component in a thirdpreferred embodiment of the present invention. FIG. 15 is a diagram ofthe composite electronic component in FIG. 14 as seen in the directionof an arrow XV. FIG. 16 is a diagram of the composite electroniccomponent in FIG. 14 as seen in the direction of an arrow XVI. FIG. 17is a cross-sectional view of the composite electronic component in FIG.15 as seen in the direction of an arrow XVII-XVII. FIG. 18 is across-sectional view of the composite electronic component in FIG. 15 asseen in the direction of an arrow XVIII-XVIII. FIG. 19 is across-sectional view of the composite electronic component in FIG. 14 asseen in the direction of an arrow XIX-XIX.

As shown in FIGS. 14 to 19, a composite electronic component 1D in athird preferred embodiment of the present invention includes a capacitordevice 10A and a resistor device 20D. In the present preferredembodiment, the first and second connection conductors are each definedby only a conductor located on the outer peripheral surface of base 21,and third and fourth connection conductors are each defined by only aconductor located on the outer peripheral surface of base 21.

Capacitor body 11 of capacitor device 10A includes a plurality ofinternal electrode layers 13 that are stacked together. Among aplurality of internal electrode layers 13, one of a pair of internalelectrode layers 13 that are adjacent to each other is electricallyconnected to one of first and second external electrodes 14A and 14B,and the other of the pair of internal electrode layers 13 iselectrically connected to the other of first and second externalelectrodes 14A and 14B. The stacking direction in which a plurality ofinternal electrode layers 13 are stacked is preferably perpendicular orsubstantially perpendicular to height direction H and parallel orsubstantially parallel to width direction W.

As described above, capacitor body 11 is fabricated by stacking aplurality of ceramic green sheets each with a conductive paste printedthereon, and pressing these sheets in the direction in which they arestacked together. In the resultant stack formed by pressing, the portionwhere internal electrode layers 13 are located differs in thickness fromthe portion where internal electrode layers 13 are not located.Specifically, the thickness of the portion where internal electrodelayers 13 are located is larger than the thickness of the portion whereinternal electrode layers 13 are not located.

Consequently, as seen in length direction L, the surfaces of capacitordevice 10A that cross the stack direction in which a plurality ofinternal electrode layers 13 are stacked are curved outward in a convexshape. Specifically, each of the side surfaces of capacitor body 11 iscurved so that its center in height direction H is located outward inwidth direction W relative to its ends in height direction H.

In the present preferred embodiment, as seen in length direction L, thesurfaces of capacitor device 10A that extend along the stack directionof a plurality of internal electrode layers 13 are curved so thatrespective centers are recessed inward. Specifically, each of the pairof main surfaces of capacitor body 11 is curved so that its ends inwidth direction W protrude outward in height direction H relative to itscenter in width direction W. The depth of the recess of each curvedsurface is preferably about 5 μm or less, for example. As seen in lengthdirection L, the surfaces of capacitor device 10A that extend along thestack direction of a plurality of internal electrode layers 13 are morepreferably flat surfaces.

In composite electronic component 1D, first upper surface conductor 24Aand first external electrode 14A are connected to each other throughfirst joint member 31, and second upper surface conductor 24B and secondexternal electrode 14B are connected to each other through second jointmember 32. First upper surface conductor 24A and first externalelectrode 14A are not in direct contact with each other, and secondupper surface conductor 24B and second external electrode 14B are not indirect contact with each other.

Preferably, each of first joint member 31 and second joint member 32 hasa thickness of about 10 μm or more, for example. Preferably, theshortest distance between lower surface 11 a of capacitor body 11 andresistor device 20D in height direction H is about 20 μm or more, forexample.

In the present preferred embodiment, each of first joint member 31 andsecond joint member 32 is made of a conductive joint material. A maincomponent of the conductive joint material is preferably Sn (tin), forexample. The conductive joint material may contain Sb (antimony) or Au(gold). Ag (silver) and Cu (copper) are absent in the conductive jointmaterial. The conductive joint material preferably has a melting pointof about 237° C. or more, for example. The conductive joint material maynot be used, and each of first joint member 31 and second joint member32 may be formed by re-melted Sn plating on the surfaces of first andsecond upper surface conductors 24A and 24B or first and second externalelectrodes 14A and 14B.

On lower surface 21 b of base 21, a protective film 29 is preferablydisposed to separate first and second lower surface conductors 25A and25B and third and fourth lower surface conductors 25C and 25D from eachother. Protective film 29 is preferably made of an electricallyinsulating film of a glass material, a resin material, or other suitablematerial, for example.

A step of mounting the composite electronic component on a circuit boardby sucking the composite electronic component with a mounter isdescribed. FIG. 20 is a cross-sectional view showing a state in which acomposite electronic component in which the direction in which internalelectrode layers are stacked is parallel or substantially parallel tothe height direction is sucked with a nozzle of a mounter. FIG. 21 is across-sectional view showing a state in which a composite electroniccomponent in the present preferred embodiment in which the direction inwhich internal electrode layers are stacked is perpendicular orsubstantially perpendicular to the height direction is sucked with anozzle of a mounter.

As shown in FIG. 20, in the case where a plurality of internal electrodelayers 13 of capacitor device 10 are stacked in the direction parallelor substantially parallel to the height direction H and accordingly eachof the pair of main surfaces of capacitor body 11 is curved so that itscenter in width direction W is protruded outward in height direction Hrelative to its ends in width direction W, a gap is likely to begenerated between the forward end of a nozzle 90 of the mounter and themain surface of capacitor body 11. Through this gap, air passes asindicated by an arrow 91, resulting in a decrease of the suction forceof the mounter. If the mounter is moved in this state, the accelerationapplied by operation of the mounter may cause the composite electroniccomponent to swing and the composite electronic component in an inclinedstate may be held by the mounter as shown in FIG. 20. If the compositeelectronic component held in such a state is mounted on a circuit board,the precision with which the composite electronic component ispositioned with respect to the circuit board is reduced and theobliquely inclined composite electronic component is mounted on thecircuit board.

This phenomenon may also occur when capacitor device 10 is mounted onresistor device 20D. If this phenomenon occurs when capacitor device 10is mounted on resistor device 20D, the precision with which capacitordevice 10 is positioned with respect to resistor device 20D is reducedand obliquely inclined capacitor device 10 is mounted on resistor device20D.

In composite electronic component 1D in the present preferredembodiment, the direction in which a plurality of internal electrodelayers 13 of capacitor device 10A are stacked is perpendicular orsubstantially perpendicular to height direction H, and therefore, eachof the pair of main surfaces of capacitor body 11 is curved so that itsends in width direction W protrude outward in height direction Hrelative to its center in width direction W. In this case, the forwardend of nozzle 90 of the mounter is easily brought into close contactwith the main surface of capacitor body 11. Therefore, a high suctionforce of the mounter is stably maintained and the composite electroniccomponent is held in a stable posture without being inclined. Whencomposite electronic component 1D is mounted on a circuit board,composite electronic component 1D is positioned with respect to thecircuit board with high precision and composite electronic component 1Dis mounted on the circuit board in a stable posture without beinginclined.

Similarly, regarding composite electronic component 1D in the presentpreferred embodiment, when capacitor device 10A is mounted on resistordevice 20D, capacitor device 10A is positioned with respect to resistordevice 20D with high precision and capacitor device 10A is mounted onresistor device 20D in a stable posture without being inclined.

Regarding composite electronic component 1D in the present preferredembodiment, the melting point of a conductive joint material used foreach of first and second joint members 31 and 32 is preferably higherthan the melting point of a solder used to mount composite electroniccomponent 1D on a circuit board. Therefore, when composite electroniccomponent 1D is mounted on the circuit board, each of first and secondjoint members 31 and is less likely to be re-melted. Consequently,positional displacement of resistor device 20D and capacitor device 10Arelative to each other is less likely to occur, and a short circuitbetween composite electronic component 1D and an electronic componentdisposed in the vicinity of composite electronic component 1D is reducedor prevented. Moreover, occurrence of solder flash is reduced orprevented.

Solder flash is a phenomenon as follows. When elements joined togetherby a solder are sealed by a resin and the solder is heated again to atemperature of its melting point or higher, the solder is melted toexpand and accordingly extend along the interface between the resin andthe elements while breaking the interface.

In composite electronic component 1D in the present preferredembodiment, first upper surface conductor 24A is not in direct contactwith first external electrode 14A and second upper surface conductor 24Bis not in direct contact with second external electrode 14B. An adequatethickness of each of first and second joint members 31 and 32 is thusensured. Consequently, in each of first and second joint members 31 and32, the occurrence of voids in the conductive joint material is reducedor prevented and an adequate joint strength between resistor device 20Dand capacitor device 10A is stably provided.

Between lower surface 11 a of capacitor body 11 and resistor device 20D,an adequate space in height direction H is provided. This enables acleaning fluid to easily enter the space between lower surface 11 a ofcapacitor body 11 and resistor device 20D and reliably remove fluxresidue. When a visual inspection of the joint between resistor device20D and capacitor device 10A is conducted, the space in height directionH between lower surface 11 a of capacitor body 11 and resistor device20D facilitates visual recognition and evaluation of the joint betweenfirst upper surface conductor 24A and first external electrode 14A andthe joint between second upper surface conductor 24B and second externalelectrode 14B.

Fourth Preferred Embodiment

A composite electronic component in a fourth preferred embodiment of thepresent invention is described below. A composite electronic component1E in the present preferred embodiment differs from composite electroniccomponent 1D in the third preferred embodiment in terms of theconfiguration of the first and second external electrodes as well as aresin film disposed on the surface of the first and second jointmembers. Features similar to those of composite electronic component 1Din the third preferred embodiment are therefore not repeated.

FIG. 22 is a side view of a composite electronic component in the fourthpreferred embodiment of the present invention. FIG. 23 is a diagram ofthe composite electronic component in FIG. 22 as seen in the directionof an arrow XXIII. FIG. 24 is a diagram of the composite electroniccomponent in FIG. 22 as seen in the direction of an arrow XXIV.

As shown in FIGS. 22 to 24, composite electronic component 1E in thefourth preferred embodiment of the present invention includes acapacitor device 10B and a resistor device 20D. A first externalelectrode 14A1 and a second external electrode 14B1 of capacitor device10B each preferably includes an Sn (tin) plating layer 141 and an Sn—Ni(nickel) layer 142 covered by Sn plating layer 141 and containing anintermetallic compound of Sn and Ni, for example.

Specifically, first external electrode 14A1 and second externalelectrode 14B1 each preferably includes, in order from the outer one, Snplating layer 141, Sn—NI layer 142, and an Ni plating layer (not shown),for example. Sn—Ni layer 142 is formed preferably by alloying of Sn inSn plating layer 141 and Ni in the Ni plating layer Ni.

Sn—Ni layer 142 is exposed from at least a portion of each of firstexternal electrode 14A1 and second external electrode 14B1. In thepresent preferred embodiment, Sn—Ni layer 142 is exposed from thevertices and edges of each of first external electrode 14A1 and secondexternal electrode 14B1. On the exposed surface of Sn—Ni layer 142, anoxide coating is formed due to contact with the air. The oxide coatingon Sn—Ni layer 142 has a property that makes the material forming firstjoint member 31 and second joint member 32 less likely to adhere to theoxide film and has electrical insulation property.

As to the method for exposing Sn—Ni layer 142, the portions of first andsecond external electrodes 14A1 and 14A2 in which Sn—Ni layer 142 is notto be exposed are masked. Masked capacitor device 10B is immersed in astripping solution. As the stripping solution, ENSTRIP® that selectivelydissolves Sn may preferably be used, for example.

The portion of each of first and second external electrodes 14A1 and14B1 in which Sn—Ni layer 142 is exposed is not limited to the verticesand edges, and the entirety of the portion covering the side surfacesand the top surface of capacitor body 11 may include an exposed Sn—Nilayer 142, for example. In this case, Sn plating layer 141 is located inonly the surface of the portion of each of first and second externalelectrodes 14A1 and 14B1 that covers lower surface 11 a of capacitorbody 11.

In composite electronic component 1E in the fourth preferred embodimentof the present invention, resin films 31 c and 32 c each extendingcontinuously on capacitor device 10B and resistor device 20D cover atleast a portion of the surfaces of first and second joint members 31 and32. In the present preferred embodiment, resin film 31 c covers theentire or substantially the entire surface of first joint member 31, andresin film 32 c covers the entire or substantially the entire surface ofsecond joint member 32. Resin films 31 c and 32 c may fill a gap betweencapacitor device 10B and resistor device 20D.

Resin films 31 c and 32 c are each preferable made of epoxy resin,urethane resin, or other suitable resin containing hardener and/orinorganic filler, for example. The heatproof temperature of resin films31 c and 32 c is preferably higher than the melting point of thematerial forming first and second joint members 31 and 32.

When capacitor device 10B is joined to resistor device 20D, Sn meltedfrom Sn plating layer 141 flows onto the end surfaces of capacitor body11 due to surface tension, causing a phenomenon of increasing the lengthof capacitor device 10B. In composite electronic component 1E in thefourth preferred embodiment, Sn plating layer 141 is partially removedfrom each of first and second external electrodes 14A1 and 14B1, whichmakes it less likely that the phenomenon of increasing the length ofcapacitor device 10B occurs.

Sn—Ni layer 142 is preferably exposed from the vertices and edges ofeach of first and second external electrodes 14A1 and 14B1, andtherefore, even when at least one of first and second externalelectrodes 14A1 and 14B1 of composite electronic component 1E is broughtinto contact with an adjacent electronic component, at the positionwhere Sn—Ni layer 142 is exposed, the electrical insulation property ofSn—Ni layer 142 reduces or prevents a short circuit between thiselectronic component and composite electronic component 1E.

Regarding composite electronic component 1E in the fourth preferredembodiment, the phenomenon of increasing the length of capacitor device10B is less likely to occur and the occurrence of a short circuitbetween composite electronic component 1E and an adjacent electroniccomponent is reduced or prevented as described above, which enableselectronic components to be integrated on a circuit board at a highdensity.

In composite electronic component 1E in the fourth preferred embodiment,resin films 31 c and 32 c extending continuously on capacitor device 10Band resistor device 20D are disposed on first and second joint members31 and 32. Accordingly, the area of the joint between capacitor device10B and resistor device 20D is increased, and consequently, the strengthof the joint between capacitor device 10B and resistor device 20D isincreased.

The heatproof temperature of resin films 31 c and 32 c is higher thanthe melting point of the material forming first and second joint members31 and 32. Therefore, when composite electronic component 1E is mountedon a circuit board and first and second joint members 31 and 32 are eachre-melted, positional displacement of resistor device 20D and capacitordevice 10B relative to each other is less likely to occur.

In the present preferred embodiment, resin film 31 c preferably coversthe entire or substantially the entire surface of first joint member 31and resin film 32 c covers the whole surface of second joint member 32.Therefore, when first and second joint members 31 and 32 are each madeof a solder, flow of the re-melted solder is blocked by resin films 31 cand 32 c and the occurrence of solder flash is reduced or prevented.

Fifth Preferred Embodiment

A composite electronic component in a fifth preferred embodiment of thepresent invention is described below. A composite electronic component1F in the present preferred embodiment differs from composite electroniccomponent 1D in the third preferred embodiment in that the width offirst and second external electrodes is smaller than the width of thecapacitor body. Features similar to those of composite electroniccomponent 1D in the third preferred embodiment are therefore notrepeated.

FIG. 25 is a side view of a composite electronic component in the fifthpreferred embodiment of the present invention. FIG. 26 is a diagram ofthe composite electronic component in FIG. 25 as seen in the directionof an arrow XXVI. FIG. 27 is a diagram of the composite electroniccomponent in FIG. 25 as seen in the direction of an arrow XXVII.

As shown in FIGS. 25 to 27, composite electronic component 1F in thefifth preferred embodiment includes a capacitor device 10C and aresistor device 20D. The width of each of first and second externalelectrodes 14A2 and 14B2 of capacitor device 10C is preferably smallerthan the width of capacitor body 11.

First external electrode 14A2 is disposed continuously on one endsurface of capacitor body 11 and a portion of each of the pair of mainsurfaces of capacitor body 11. Second external electrode 14B2 isdisposed continuously on the other end surface of capacitor body 11 anda portion of each of the pair of main surfaces of capacitor body 11. Themanner of disposing first and second external electrodes 14A2 and 14B2,however, is not limited to this. First external electrode 14A2 may bedisposed continuously on one end surface and a portion of lower surface11 a of capacitor body 11, or disposed on only a portion of lowersurface 11 a. Second external electrode 14B2 may be disposedcontinuously on the other end surface and a portion of lower surface 11a of capacitor body 11, or disposed on only a portion of lower surface11 a.

Regarding composite electronic component 1F in the fifth preferredembodiment, the width of each of first and second external electrodes14A2 and 14B2 is preferably smaller than the width of capacitor body 11.Therefore, even when composite electronic component 1F is brought intocontact with an adjacent electronic component, at the position of theside surface of capacitor body 11 where first and second externalelectrodes 14A2 and 14B2 of capacitor device 10C are absent, a shortcircuit between the electronic component and composite electroniccomponent 1F is prevented.

As to the composite electronic components in the first to fifthpreferred embodiments, the width of the resistor device may be largerthan the width of the capacitor device. The length of the resistordevice may be larger than the length of the capacitor device.

FIG. 28 is a perspective view showing a composite electronic componentin which a resistor device is larger in width than a capacitor deviceand larger in length than the capacitor device. FIG. 29 is a perspectiveview showing a composite electronic component in which a resistor deviceis larger in width than a capacitor device and smaller in length thanthe capacitor device.

As to the composite electronic components in the first to fifthpreferred embodiments, width Wr of resistor device 20 may be larger thanwidth Wc of capacitor device 10 and length Lr of resistor device 20 maybe larger than length Lc of capacitor device 10, as shown in FIG. 28.Alternatively, as to the composite electronic components in the first tofifth preferred embodiments, width Wr of resistor device 20 may belarger than width Wc of capacitor device 10 and length Lr of resistordevice 20 may be smaller than length Lc of capacitor device 10, as shownin FIG. 29.

FIG. 30 is a side view showing a state in which a composite electroniccomponent in which a resistor device is equal in width to a capacitordevice is mounted in an inclined posture on a circuit board. FIG. 31 isa side view showing a state in which a composite electronic component inwhich a resistor device is larger in width than a capacitor device ismounted in an inclined posture on a circuit board.

As shown in FIG. 30, when width Wr of resistor device 20 is equal to orless than width Wc of capacitor device 10 and the composite electroniccomponent is mounted in an inclined posture on circuit board 100 as seenin length direction L, capacitor device 10 is partially located outsidethe region in width direction W in which resistor device 20 is located.Then, there is a possibility that an adjacently disposed electroniccomponent and capacitor device 10 are brought into contact with eachother and short-circuited.

As shown in FIG. 31, when width Wr of resistor device 20 is larger thanwidth Wc of capacitor device 10 and the composite electronic componentis mounted in an inclined posture on circuit board 100 as seen in lengthdirection L, capacitor device 10 is less likely to be located outsidethe region in width direction W in which resistor device 20 is located.Thus, the possibility that an adjacently disposed electronic componentand capacitor device 10 are brought into contact with each other andshort-circuited is reduced.

Likewise, when length Lr of resistor device 20 is equal to or less thanlength Lc of capacitor device 10 and the composite electronic componentis mounted in an inclined posture on circuit board 100 as seen in widthdirection W, capacitor device 10 is partially located outside the regionin length direction L in which resistor device 20 is located. Thus,there is a possibility that an adjacently disposed electronic componentand capacitor device 10 are brought into contact with each other andshort-circuited.

When length Lr of resistor device 20 is larger than length Lc ofcapacitor device 10 and the composite electronic component is mounted inan inclined posture on circuit board 100 as seen in width direction W,capacitor device 10 is less likely to be located outside the region inlength direction L in which resistor device 20 is located. Thus, thepossibility that an adjacently disposed electronic component andcapacitor device 10 are brought into contact with each other andshort-circuited is reduced.

Thus, width Wr of resistor device 20 larger than width We of capacitordevice 10 or length Lr of resistor device 20 larger than length Lc ofcapacitor device 10 enables a reduction of the distance betweenelectronic components mounted on circuit board 100 and, therefore,enables downsizing of circuit board 100.

Regarding the preferred embodiments and their modifications of thepresent invention, use of a multilayer ceramic capacitor as a capacitordevice to be included in the composite electronic component is describedby way of example. Alternatively, any of other types of capacitordevices may be included in the composite electronic component, insteadof the multilayer ceramic capacitor.

Moreover, regarding the preferred embodiments and their modifications ofthe present invention, use of a multilayer ceramic capacitor as anelectronic component to be mounted on the resistor device is describedby way of example. The electronic component to be mounted on theresistor device may be any capacitor device other than the multilayerceramic capacitor, and may be any of other electronic components, suchas an inductor device, a thermistor device, a piezoelectric device, andother suitable devices. The inductor device as compared to themultilayer ceramic capacitor includes a coil-shaped conductor layerinstead of the internal electrode layer and a pair of external terminalsfor the coil-shaped conductor layer are disposed on the surface of thebody instead of the pair of external electrodes.

Further, respective characteristic features illustrated in connectionwith the preferred embodiments and their modifications of the presentinvention may be combined in any way without going beyond the intendedscope of the present invention.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A composite electronic component comprising: a resistor device; and a capacitor device mounted on the resistor device in a height direction; wherein the resistor device includes: an electrically insulating base including an upper surface and a lower surface opposite to each other in the height direction; a resistive element disposed on the base; a first upper surface conductor and a second upper surface conductor disposed on the upper surface of the base and separated from each other in a length direction perpendicular or substantially perpendicular to the height direction; a first lower surface conductor and a second lower surface conductor disposed on the lower surface of the base and separated from each other in the length direction; a first connection conductor connecting the first upper surface conductor to the first lower surface conductor; and a second connection conductor connecting the second upper surface conductor to the second lower surface conductor; the capacitor device includes: a capacitor body including a lower surface crossing the height direction; and a first external electrode and a second external electrode disposed on an outer surface of the capacitor body and separated from each other in the length direction; the upper surface of the base faces the lower surface of the capacitor body in the height direction, the first upper surface conductor is electrically connected to the first external electrode, and the second upper surface conductor is electrically connected to the second external electrode; and the first connection conductor and the second connection conductor are each defined by only a conductor located on an outer peripheral surface of the base.
 2. The composite electronic component according to claim 1, wherein the resistive element is disposed on the upper surface of the base and located between the first upper surface conductor and the second upper surface conductor in the length direction; the resistor device further includes: a third upper surface conductor and a fourth upper surface conductor disposed on the upper surface of the base, located between the first upper surface conductor and the second upper surface conductor in the length direction, and separated from each other; a third lower surface conductor and a fourth lower surface conductor disposed on the lower surface of the base, located between the first lower surface conductor and the second lower surface conductor in the length direction, and separated from each other; a third connection conductor connecting the third upper surface conductor to the third lower surface conductor; and a fourth connection conductor connecting the fourth upper surface conductor to the fourth lower surface conductor; the third upper surface conductor and the fourth upper surface conductor are connected to the resistive element; and the third connection conductor and the fourth connection conductor are each defined by only a conductor located on the outer peripheral surface of the base.
 3. The composite electronic component according to claim 2, wherein the third upper surface conductor and the fourth upper surface conductor are separated from each other in a width direction perpendicular or substantially perpendicular to the height direction and to the length direction.
 4. The composite electronic component according to claim 2, wherein the resistor device further includes a protective film covering the resistive element.
 5. The composite electronic component according to claim 4, wherein a maximum height of the protective film from the upper surface of the base is larger than respective maximum heights of the first upper surface conductor and the second upper surface conductor from the upper surface of the base.
 6. The composite electronic component according to claim 1, wherein the resistive element is disposed on the upper surface of the base; and the first upper surface conductor and the second upper surface conductor are connected to the resistive element.
 7. The composite electronic component according to claim 1, wherein the resistive element is disposed on the lower surface of the base and located between the first lower surface conductor and the second lower surface conductor in the length direction; the resistor device further includes a third lower surface conductor and a fourth lower surface conductor disposed on the lower surface of the base, located between the first lower surface conductor and the second lower surface conductor in the length direction, and separated from each other; and the third lower surface conductor and the fourth lower surface conductor are connected to the resistive element.
 8. The composite electronic component according to claim 7, wherein the third lower surface conductor and the fourth lower surface conductor are separated from each other in a width direction perpendicular or substantially perpendicular to the height direction and to the length direction.
 9. The composite electronic component according to claim 7, wherein the resistor device further includes a protective film covering the resistive element.
 10. The composite electronic component according to claim 1, wherein the capacitor body includes a plurality of internal electrode layers that are stacked; one of a pair of internal electrode layers adjacent to each other among the plurality of internal electrode layers is electrically connected to one of the first external electrode and the second external electrode and another of the pair of internal electrode layers is electrically connected to another of the first external electrode and the second external electrode; and a direction in which the plurality of internal electrode layers are stacked together is perpendicular or substantially perpendicular to the height direction.
 11. The composite electronic component according to claim 1, wherein the first upper surface conductor and the first external electrode are connected to each other through a first joint member; the second upper surface conductor and the second external electrode are connected to each other through a second joint member; and the first joint member and the second joint member are each made of a conductive joint material.
 12. The composite electronic component according to claim 11, wherein the conductive joint material contains Sn and Sb or contains Sn and Au.
 13. The composite electronic component according to claim 11, wherein Ag and Cu are absent from the conductive joint material.
 14. The composite electronic component according to claim 11, wherein the conductive joint material has a melting point of about 237° C. or more.
 15. The composite electronic component according to claim 11, wherein a resin film extending continuously on the capacitor device and the resistor device covers at least a portion of a surface of each of the first joint member and the second joint member.
 16. The composite electronic component according to claim 15, wherein the resin film covers an entire surface of each of the first joint member and the second joint member.
 17. The composite electronic component according to claim 1, wherein the first external electrode and the second external electrode each include an Sn plating layer and an Sn—Ni layer covered by the Sn plating layer and including an intermetallic compound of Sn and Ni; and the Sn—Ni layer is exposed from at least a portion of each of the first external electrode and the second external electrode.
 18. The composite electronic component according to claim 17, wherein the Sn—Ni layer is exposed from vertices and edges of each of the first external electrode and the second external electrode.
 19. The composite electronic component according to claim 1, wherein the first external electrode and the second external electrode are each smaller in width than the capacitor body.
 20. The composite electronic component according to claim 1, wherein the resistor device is larger in width than the capacitor device. 